For my future Ten64 board, I would like to change the case and go to a rackable 1U, short depth, case.
Since we have ATX accessories shipped with the Ten64 board, I was wondering if there are any recommendations available for a server case (1u, 19 inch) that would be known to be compatible?
I have mine in the IW-RF100 - it basically works - with a couple of modifications.
The RAM is fine, but the fan mount needs to be reversed, and then the board raised off of the standoffs by a few mm as the board has mechanical interference with the fan mounting posts.
The other issue I think may come up is the heat sink fins are the wrong way to the air flow, so it may limit performance down the line a bit - I am still building / prototyping the os, so I haven’t hit any major temperatures yet.
If you do get a drawing of the IO shield that would be great - happy to release any dxf / stl files I create for 3d printing or cutting. Right now, I am trying to measure everything, which is a bit tedious, and slightly error prone
Is it possible to supply 3D CAD geometry for the Ten64 circuit card assembly (PCB and components/connectors? If so, file format would ideally be a Solidworks file, but .STEP, .IGES, or Parasolid would be ok. This would be to enable modelling the Ten64 card mounted to a 1U 19 inch rack enclosure with fan and PSU and custom front and back interface panels.
I had to remove the fan on top of the heatsink, but I upgraded the fans to 3x noctua, so airflow is “fine” - keep a cpu temp of ~ 50C, with fans at about 50-60% speed. I am using DAC cables, so heat isn’t a huge issue for the SFP+ cages, but if you have optics in there, I would probably want to do a little better on airflow management.